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datashee t product structure silicon monolithic integrated circuit this product has no designed for prot ection against radioactive rays . 1/16 tsz02201-0p2p0b300340-1-2 ? 2013 rohm co., ltd. all rights reserved. 26.feb.2014 rev.002 tsz22111 ? 14? 001 www.rohm.com dc brush motor drivers (36v max.) BD6232HFP-LB general description this is the product guarantees long time support in industrial market. BD6232HFP-LB is full bridge drivers for brush motor applications. this ic can operate at a wide range of power supply voltages (from 6v to 32v), with output currents of up to 1a. mos tran sistors in the output stage allow pwm speed control. the integrated vref voltage control function allows dire ct replacement of deprecated motor driver ics. this highly efficient h-bridge driver ic facilitate low-power consumption design. features ? long time support product for industrial applications. ? vref voltage setting pin enables pwm duty control ? cross-conduction prevention circuit ? four protection circuits provided: ocp, ovp, tsd and uvlo applications industrial equipment; vtr; cd/dvd players; audio-visual equipment; optical disc drives; pc peripherals; oa equipments key specifications supply voltage range: 36v(max.) maximum output current: 1.0a output on resistance: 1.0 ? pwm input frequency range: 20 to 100khz standby current: 0 a (typ.) operating temperature range: -25 to 85 package (typ.) (typ.) (max.) hrp7 9.395mm x 10.540mm x 2.005mm ordering information b d 6 2 3 2 h f p l b t r part numbe r package hfp: hrp7 product class lb for industrial applications packaging and forming specification tr: embossed taping hrp7 (pd=1.60w) * pd : mounted on a 70mm x 70mm x 1.6mm g lass-e p ox y
datasheet datasheet 2/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 block diagrams / pin configurations / pin descriptions figure 1. block diagram figure 2. pin configurations table 1 pin descriptions pin name function 1 vref duty setting pin 2 out1 driver output 3 fin control input (forward) 4 gnd ground 5 rin control input (reverse) 6 out2 driver output 7 vcc power supply fin gnd ground vref out1 fin gnd rin out2 vcc 7 6 2 3 5 ctrl protect fin rin vcc out1 out2 4 gnd 1 vref duty fin gnd
datasheet datasheet 3/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 absolute maximum ratings (ta=25 , all voltages are with respect to ground) parameter symbol ratings unit supply voltage vcc 36 v output current i omax 1.0 * 1 a all other input pins v in -0.3 to vcc v operating temperature t opr -25 to +85 storage temperature t stg -55 to +150 power dissipation pd 1.6 * 2 w junction temperature t jmax 150 *1 do not exceed pd or aso. *2 mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. derate by 12.8mw/ above 25 . recommended operating ratings (ta=25 ) parameter symbol ratings unit supply voltage vcc 6 to 32 v vref voltage vref 3 to 32 v electrical characteristics (unless otherwise specified, ta=25 and vcc=vref=24v) parameter symbol limits unit conditions min. min. min. supply current (1ch) i cc 0.8 1.3 2.5 ma forward / reverse / brake supply current (2ch) i cc 1.3 2.0 3.5 ma forward / reverse / brake stand-by current i stby - 0 10 a stand-by input high voltage v ih 2.0 - - v input low voltage v il - - 0.8 v input bias current i ih 30 50 100 a v in =5.0v output on resistance r on 0.5 1.0 1.5 ? i o =1.0a, vertically total vref bias current i vref -10 0 10 a vref=vcc carrier frequency f pwm 20 25 35 khz vref=18v input frequency range f max 20 - 100 khz fin / rin
datasheet datasheet 4/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) figure 3. supply current figure 4. input threshold voltage figure 5. input bias current figure 6. vref input bias current 0.5 1.0 1.5 2.0 2.5 6 1218243036 supply voltage: vcc [v] circuit current: icc [ma] 85c 25c -40c -0.5 0.0 0.5 1.0 1.5 0.8 1.2 1.6 2 input voltage: vin [v] internal logic: h/l [-] _ -40c 25c 85c -40c 25c 85c -10 -5 0 5 10 0 6 12 18 24 30 36 input voltage: vref [v] input bias current: ivref[a] -40c 25c 85c 0.0 0.2 0.4 0.6 0.8 1.0 0 6 12 18 24 30 36 input voltage: vin [v] input bias current: iih [ma] _ 85c 25c -40c
datasheet datasheet 5/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) - continued figure 9. under voltage lock out figure 10. over voltage protection figure 7. vref - duty figure 8. vcc - carrier frequency (vcc=24v) 0.0 0.2 0.4 0.6 0.8 1.0 0 0.2 0.4 0.6 0.8 1 input voltage: vref / vcc [v] switching duty: d [ton/t] _ -40c 25c 85c 10 20 30 40 6 1218243036 supply voltage: vcc [v] oscillation frequency: fpwm [khz] 85c 25c -40c 0 3 6 9 4.555.56 supply voltage: vcc [v] internal signal: release [v] _ 85c 25c -40c 0 12 24 36 48 36 40 44 48 supply voltage: vcc [v] internal signal: release [v] -40c 25c 85c
datasheet datasheet 6/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) - continued figure 13. over current protection (l side) figure 14. output high voltage figure 11. thermal shutdown figure 12. over current protection (h side) -0.5 0.0 0.5 1.0 1.5 125 150 175 200 junction temperature: tj [c] internal logic: h/l [-] -0.5 0.0 0.5 1.0 1.5 5.5 5.75 6 6.25 6.5 6.75 7 load current / iomax internal logic: h/l [-] 85c 25c -40c 0 0.5 1 1.5 2 0 0.4 0.8 1.2 1.6 2 output current: iout [a] output voltage: vcc-vout [v] 85c 25c -40c -0.5 0.0 0.5 1.0 1.5 2 2.25 2.5 2.75 3 3.25 3.5 load current / iomax internal logic: h/l [-] 85c 25c -40c
datasheet datasheet 7/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) ? continued figure 15. high side body diode figure 16. output low voltage figure 17. low side body diode 0 0.5 1 1.5 2 0 0.4 0.8 1.2 1.6 2 output current: iout [a] output voltage:v cc-vout [v] -40c 25c 85c 0 0.5 1 1.5 2 00.40.81.21.62 output current: iout [a] output voltage: vout [v] 85c 25c -40c 0 0.5 1 1.5 2 0 0.4 0.8 1.2 1.6 2 output current: iout [a] output voltage: vout [v] -40c 25c 85c
datasheet datasheet 8/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 functional descriptions 1) operation modes table 2 logic table fin rin vref out1 out2 operation a l l x hi-z* hi-z* stand-by (idling) b h l vcc h l forward (out1 > out2) c l h vcc l h reverse (out1 < out2) d h h x l l brake (stop) e pwm l vcc h pwm __________ forward (pwm control mode a) f l pwm vcc pwm __________ h reverse (pwm control mode a) g h pwm vcc pwm __________ l forward (pwm control mode b) h pwm h vcc l pwm __________ reverse (pwm control mode b) i h l option h pwm __________ forward (vref control) j l h option pwm __________ h reverse (vref control) * hi-z : all output transistors are off. please note that this is the state of the connected diodes, which differs from that of the mechanical relay. x : don?t care a) stand-by mode stand-by operates independently with t he vref pin voltage. in stand-by mode, all internal circuits are turned off, including the output power transistors. motor output goes to high impedance. when the system is switched to stand-by mode while the motor is running, the system ente rs an idling state because of the body diodes. however, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50s before shutting down all circuits. b) forward mode this operating mode is defined as the fo rward rotation of the motor when the out1 pin is high and out2 pin is low. when the motor is connected between the out1 and out2 pins, the current flows from out1 to out2. to operate in this mode, connect the vref pin to the vcc pin. c) reverse mode this operating mode is defined as the reverse rotation of the motor when the out1 pin is low and out2 pin is high. when the motor is connected between the out1 and out2 pins, the current flows from out2 to out1. to operate in this mode, connect the vref pin to the vcc pin. d) brake mode this operating mode is used to quickly stop the motor (shor t circuit brake). it differs from the stand-by mode because the internal control circuit is operating in the brake mo de. please switch to stand-by mode (rather than the brake mode) to save power and reduce consumption. a) stand-by mode b) forward mode c) reverse mode d) brake mode figure 18. four basic operations (output stage) m on off off on m off on on off m off on off on off off off off m
datasheet datasheet 9/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 e) f) pwm control mode a the rotational speed of the motor can be controlled by the duty cycle of the pwm signal fed to the fin pin or the rin pin. in this mode, the hi gh side output is fixed and the low side output is switching, corresponding to the input signal. the state of the output t oggles between "l" and "hi-z". the frequency of the input pwm signal can be between 20khz and 100khz. the circuit may not operate properly for pwm frequencies below 20khz and above 100khz. note that c ontrol may not be attained by switching on duty at frequencies lower than 20khz, since the operation functions via the stand-by mode. to operate in this mode, connect the vref pin to the vcc pin. in addition, establis h a current path for the recovery current from the motor, by connecting a bypass capacitor (10f or higher is recommended) between vcc and ground. control input : h control input : l figure 19. pwm control m ode a operation (output stage) figure 20. pwm control mode a operation (timing chart) g) h) pwm control mode b the rotational speed of the motor can be controlled by the duty cycle of the pwm signal fed to the fin pin or the rin pin. in this mode, the low side out put is fixed and the high side output is switching, corresponding to the input signal. the state of the output toggles between "l" and "h". the frequency of the input pwm signal can be between 20khz and 100khz. the circuit may not operate properly for pwm frequencies below 20khz and above 100khz. to operate in this mode, connect the vref pin to the vcc pin. in addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10f or higher is recommended) between vcc and ground. control input : h control input : l figure 21. pwm control m ode b operation (output stage) figure 22. pwm control mode b operation (timing chart) fin rin out1 out2 fin rin out1 out2 m on off off on m on off off off m on off off on m on off off off
datasheet datasheet 10/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 i) j) vref control mode the built-in vref duty cycle conversion circuit provides a duty cycle corresponding to the voltage of the vref pin and the vcc voltage. the function offers the same level of control as the high voltage output setting function in previous models. the duty cycle is calculated by the following equation. duty vref [v] / vcc [v] for example, if vcc voltage is 24v and vref pin voltage is 18v, the duty cycle is about 75 percent. however, please note that the duty cycle might be limited by the range of the vref pin voltage (refer to the operating conditions, shown on page 2). the pwm carrier frequency in this mode is 25khz (nominal), and the switching operation is the same as the pwm control modes. when operating in this mode, do not input a pwm signal to the fin and rin pins. in addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10f or more is recommended) between vcc and ground. figure 23. vref control operation (timing chart) 2) cross-conduction protection circuit in the full bridge output stage, when the upper and lower transistors are turned on at the same time during high to low or low to high transition, an inrush current flows from t he power supply to ground, resulting to a loss. this circuit eliminates the inrush current by providing a dead time (about 400ns, nominal) during the transition. 3) output protection circuits a) under voltage lock out (uvlo) circuit to ensure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a uvlo circuit has been built into this driver. when the power supply voltage falls to 5.0v (nominal) or below, the controller forces all driver outputs to high imp edance. when the voltage rises to 5.5v (nominal) or above, the uvlo circuit ends the lockout operation and returns the chip to normal operation. b) over voltage protection (ovp) circuit when the power supply voltage exceeds 45v (nominal), the controller forces all driver outputs to high impedance. the ovp circuit is released and its operation ends when t he voltage drops back to 40v (nominal) or below. this protection circuit does not work in the stand-by mode. also, note that this circuit is suppl ementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. therefore, do not continue to use the ic after this circuit is activated, and do not operate the ic in an en vironment where activation of the circuit is assumed. vcc vref fin rin out1 out2 0
datasheet datasheet 11/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 c) thermal shutdown (tsd) circuit the tsd circuit operates when the junction temperature of the driver exceeds the preset temperature (175 nominal). at this time, the controller forces all driver out puts to high impedance. since thermal hysteresis is provided in the tsd circuit, the chip returns to normal operatio n when the junction temperature falls below the preset temperature (150 nominal). thus, it is a self-resetting circuit. the tsd circuit is designed only to shut the ic off to prev ent thermal runaway. it is not designed to protect the ic or guarantee its operation in the presence of extreme heat. do not continue to use the ic after the tsd circuit is activated, and do not oper ate the ic in an environment where activation of the circuit is assumed. d) over current protection (ocp) circuit to protect this driver ic from ground faults, power supply line faults and load short circuits, the ocp circuit monitors the output current for the circuit?s monitoring time (10s , nominal). when the protection circuit detects an over current, the controller forces all driver outputs to high impe dance during the off time (290s, nominal). the ic returns to normal operation after the off time period has elapsed (sel f-returning type). at the two channels type, this circuit works independently for each channel. figure 24. over current protection (timing chart) i/o equivalent circuit figure 25. fin / rin figure 26. vref figure 27. out1 / out2 threshold iout ctrl input internal status monitor / timer 0 off on mon. off timer on fin vcc rin 100k 100k vref vcc 10k out1 out2 vcc gnd
datasheet datasheet 12/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 operational notes 1) absolute maximum ratings operating the ic over the absolute maximum ratings may damage the ic. t he damage can either be a short circuit between pins or an open circuit between pins . therefore, it is important to cons ider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. 2) reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 3) power supply lines design the pcb layout pattern to provide low impedanc e ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in t he ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to gr ound at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 4) ground voltage the voltage of the ground pin must be the lowe st voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5) thermal consideration use a thermal design that allows for a suff icient margin by taking into account t he permissible power dissipation (pd) in actual operating conditions. consid er pc that does not exceed pd in actual operating conditions (pc pd). package power dissipation : pd (w)=(tjmax ta ) / ja power dissipation : pc (w)=(vcc vo)io+vccib tjmax : maximum junction temperature=150 , ta : peripheral temperature[ ] , ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc : power dissipation [w], vcc : input voltage, vo : output voltage, io : load, ib : bias current 6) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. 7) operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 8) area of safe operation (aso) operate the ic such that th e output voltage, output current, and power dissi pation are all within the area of safe operation (aso). 9) capacitor between output and gnd if a large capacitor is connected between t he output pin and gnd pin, current from the charged capacitor can flow into the output pin and may destroy the ic wh en the vcc or vin pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 10uf between output and gnd. 10) testing on application boards when testing the ic on an application board, connecting a ca pacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removi ng it from the test setup duri ng the inspection process. to prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transport and storage. 11) switching noise when the operation mode is in pwm control or vref control, pwm switching nois e may affect the control input pins and cause ic malfunctions. in this case, insert a pull down resistor (10k ? is recommended) between each control input pin and ground.
datasheet datasheet 13/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 12) regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjace nt elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, c onditions that caus e these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a pin b other adjacent elements e b c gnd parasitic element parasitic element figure 28. example of monolithic ic structure
datasheet datasheet 14/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 marking diagram part number package part number marking BD6232HFP-LB hrp7 bd6232hfp hrp7 (top view) part number marking lot number 1pin mark
datasheet datasheet 15/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 physical dimensions tape and reel information package name hrp7
datasheet datasheet 16/16 BD6232HFP-LB tsz02201-0p2p0b300340-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 revision history date revision changes 15.feb.2013 001 new release 26.feb.2014 002 add sentence ?this is the product guarantees l ong time support in industrial market.? in general description. change ?industrial machinery? to ?long time s upport a product for industrial applications.? in features. change ?industrial machinery? to ?i ndustrial equipment? in applications. applied new style (?title?, ?o rdering information? and ?physical dimension tape and reel information?).
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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